Title:
COPPER POWDER
Document Type and Number:
Japanese Patent JP2021110034
Kind Code:
A
Abstract:
To provide a copper powder having a high sinter-initiating temperature and excellent filling properties.SOLUTION: A copper powder has: an average particle diameter (D50SEM), measured by image analysis through electron microscopic observation, of 0.1 μm or more and 0.5 μm or less; and an average circularity of 0.80 or more, wherein the average particle diameter (D50SEM) and a BET specific surfaced area (SBET) satisfy the following relational expression. Moreover in the copper powder, a ratio (D/D50SEM) of an average crystallite diameter (D) to the average particle diameter (D50SEM) is 0.1 or more and 0.5 or less.SELECTED DRAWING: None
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Inventors:
KOBAYASHI RYOTA
YOSHIDA MITSUGU
YOSHIDA MITSUGU
Application Number:
JP2020176293A
Publication Date:
August 02, 2021
Filing Date:
October 20, 2020
Export Citation:
Assignee:
TOHO TITANIUM CO LTD
International Classes:
B22F1/00; H01B5/00
Attorney, Agent or Firm:
Takahashi Hayashi & Partners