Title:
HEAT CONDUCTION STRUCTURE AND MANUFACTURING METHOD OF HEAT CONDUCTION STRUCTURE
Document Type and Number:
Japanese Patent JP2021114510
Kind Code:
A
Abstract:
To provide a heat conduction structure capable of promoting heat disposal and use of a heating element by transmitting a heat generated by the heating element to a desired position with high efficiency, and provide a manufacturing method of the heat conduction structure.SOLUTION: A heat conduction structure is structured by: a heat transfer structure part 2 by a metal material with a high heat transfer ratio, holding a heating element 4; a heat transfer plate 3 which is embedded into the heat transfer structure part 2 and has the heat transfer ratio higher than that of the heat transfer structure part 2. The heat transfer plate 3 is formed in a high rigidity formation in a waveform or an irregularity shape, and a direction having a large flexure rigidity is arranged in parallel to a flow direction of a molten metal when forming the heat transfer structure part 2 by being inserted to prevent the flowing of the molten metal from being inhibited. Also, by using a clad plate to the heat transfer plate 3, a material with large rigidity is combined with a material with the high heat conduction rate. The heat generated by the heating element 4 is transmitted from the heat transfer structure part 2 to the heat transfer plate 3, is transmitted to a destination of a heat transmission such as a heat discharge fin, etc., by the high heat transfer ratio of the heat transfer plate 3, and the heat radiation is promoted.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
IZUMO NAOTO
MORI MIKIHITO
MORI MIKIHITO
Application Number:
JP2020005588A
Publication Date:
August 05, 2021
Filing Date:
January 17, 2020
Export Citation:
Assignee:
IZUMO STORE CO LTD
SUNCAST CO LTD
SUNCAST CO LTD
International Classes:
H01L23/36; B22D17/00; B22D19/00; H01L23/373; H05K7/20
Attorney, Agent or Firm:
Iat International Patent Business Corporation