Title:
METHOD FOR MANUFACTURING DEVICE PACKAGE
Document Type and Number:
Japanese Patent JP2021118337
Kind Code:
A
Abstract:
To provide a method for manufacturing a device package which can reduce a possibility that a resin may be peeled from a substrate.SOLUTION: A method for manufacturing a device package 4 includes: a half-cut step of forming grooves 15 with a first blade having a first blade thickness along a plurality of crossing scheduled dividing lines of a substrate 10 in which the scheduled dividing lines and each device mounting region partitioned by the scheduled dividing lines are set; a device 2 mounting step of mounting devices 2 on each of the device mounting regions; a sealing step of supplying a sealing resin 6 onto the substrate 10 and sealing each of the devices 2 with the resin, filling the groove 15 with the sealing resin 6, and forming a laminated substrate 20 in which a sealing resin layer 6A is laminated on the substrate 10; and a full-cut step of cutting and dividing the laminated substrate 20 along the scheduled dividing lines with a second blade 32 having a second blade thickness W2 thinner than a first blade thickness, and forming a plurality of device packages 4.SELECTED DRAWING: Figure 6
Inventors:
WONG KAR HOO
Application Number:
JP2020012935A
Publication Date:
August 10, 2021
Filing Date:
January 29, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; H01L33/48; H01L33/52
Attorney, Agent or Firm:
Hiroshi Oue