Title:
METAL PASTE FOR JOINING, JOINT BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING JOINT BODY
Document Type and Number:
Japanese Patent JP2021127505
Kind Code:
A
Abstract:
To provide a metal paste for joining that can ensure sufficient joint strength even when performing joining under low compression in an atmosphere free of hydrogen, and provide a joint body and a semiconductor device, and a method for producing a joint body each of which uses the metal paste for joining.SOLUTION: A metal paste for joining has metal particles and a dispersion medium. The metal particles include sub micro copper particles coated with a C1-20 aliphatic or aromatic monocarboxylic acid and having a volume average particle size of 0.1 μm or more and 0.9 μm or less, and micro copper particles coated with a C1-20 aliphatic or aromatic monocarboxylic acid or a copper oxide and having a volume average particle size of 2 μm or more and 50 μm or less. The dispersion medium has an alcoholic compound that has a hydroxyl group at a terminal and has no ether linkage in a molecular chain, and a polyether alcoholic compound that has a hydroxyl group at a terminal and has ether linkage in a molecular chain. The content of the micro copper particles is 0.5 mass% or more and 50 mass% or less based on the total mass of the sub micro copper particles and micro copper particles.SELECTED DRAWING: None
Inventors:
ISHIKAWA MASARU
NAKAKO TAKEO
KAWANA YUKI
NEGISHI MOTOHIRO
NATORI MICHIKO
SAKURAI KIWA
NAKAKO TAKEO
KAWANA YUKI
NEGISHI MOTOHIRO
NATORI MICHIKO
SAKURAI KIWA
Application Number:
JP2020023528A
Publication Date:
September 02, 2021
Filing Date:
February 14, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
B22F9/00; B22F1/00; B22F1/02; B22F7/08; H01B1/22
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano