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Title:
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BONDED BODY
Document Type and Number:
Japanese Patent JP2021138941
Kind Code:
A
Abstract:
To provide an adhesive layer that has excellent heat resistance and allows its adhesion to sufficiently decrease with application of voltage.SOLUTION: The present invention pertains to an adhesive composition comprising a polymer and an ionic liquid, wherein, when an adhesive layer formed of the adhesive composition is attached to an adherend, and peeled off after applying a voltage of 10 V for 10 seconds, the amount of the ionic liquid exuded is at least 0.002 mg/cm2.SELECTED DRAWING: Figure 1

Inventors:
AKAMATSU KAORI
SUZUKI TATSUYA
TAKASHIMA MIKA
Application Number:
JP2021031014A
Publication Date:
September 16, 2021
Filing Date:
February 26, 2021
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C09J201/00; C09J5/00; C09J7/30; C09J11/06; C09J11/08; C09J133/00; C09J167/00; C09J175/04
Attorney, Agent or Firm:
Patent business corporation glory patent office