Title:
RESIN COMPOSITION, CURED FILM, AND RESIN-COATED GLASS SUBSTRATE
Document Type and Number:
Japanese Patent JP2021138947
Kind Code:
A
Abstract:
To provide a resin composition capable of forming a cured film excellent in adhesion to inorganic and organic films and having high glass surface strength.SOLUTION: A resin composition comprises at least (A) a resin with a molecular structure including a partial structure represented by the general formula (1) and a partial structure comprising ethylene having one or more aliphatic cyclic hydrocarbons added thereto, (B) an adhesion modifier, (C) an organic solvent, and (D) a surfactant.SELECTED DRAWING: None
Inventors:
KOBAYASHI HIDEYUKI
SUWA MITSUFUMI
FUKUZAKI YUSUKE
KANZAKI TATSUYA
SUWA MITSUFUMI
FUKUZAKI YUSUKE
KANZAKI TATSUYA
Application Number:
JP2021033252A
Publication Date:
September 16, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L33/00; B32B17/10; B32B27/30; C08F222/00; C08K5/00; C08K5/5455