Title:
BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDING METHOD
Document Type and Number:
Japanese Patent JP2021138991
Kind Code:
A
Abstract:
To provide a bonding material that contains a coarse metal large particle powder acting as a spacer, and does not easily crack in the metal bonding layer when bonding is performed.SOLUTION: Provided is a bonding material that contains a metal small particle powder having an average primary particle size of 150 nm or less, a metal medium particle powder having a volume-based cumulative 50% particle size (D50) measured by a laser diffraction type particle size distribution measuring device of 1.1 4.5 μm, a metal large particle power having a volume-based cumulative 90% particle size (D90) measured by a laser diffraction type particle size distribution measuring device of 7 to 40 μm, and a solvent, and in which the contained amount of the metal medium particle powder in the bonding material is 40 mass% or more.SELECTED DRAWING: Figure 2
Inventors:
FUJIMOTO HIDEYUKI
ITO DAISUKE
ENDO KEIICHI
OKANO TAKU
ITO DAISUKE
ENDO KEIICHI
OKANO TAKU
Application Number:
JP2020036455A
Publication Date:
September 16, 2021
Filing Date:
March 04, 2020
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/00; B22F7/08; H01B1/00; H01B1/22; H01B13/00
Attorney, Agent or Firm:
Aniya Setsuo
Okuyama Tomohiro
Okuyama Tomohiro