Title:
PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2021141263
Kind Code:
A
Abstract:
To provide a processing method for suppressing defects when a device individualized from workpiece is mounted.SOLUTION: A processing method is a processing method of workpiece having a plurality of bumps thereon includes: a sheet adhesion step 1001 of covering an upper surface of workpiece with a resin sheet having thickness larger than a height of the bumps, decompressing between the resin sheet and the workpiece, advancing the resin sheet between the adjacent bumps and bringing the resin sheet into contact with a surface of the workpiece; a holding step 1002 of performing the sheet adhesion step 1001, then holding the workpiece with a holding table and exposing the resin sheet; and a cutting step 1003 of performing the holding step 1002, then cutting the resin sheet covering the surface of the workpiece held by the holding table together with the bumps by a byte tool, and arranging the height of the bumps.SELECTED DRAWING: Figure 4
Inventors:
CHIN YO
KAWASE MASAYUKI
KAWASE MASAYUKI
Application Number:
JP2020039304A
Publication Date:
September 16, 2021
Filing Date:
March 06, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/60
Attorney, Agent or Firm:
Sakai International Patent Office