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Title:
ADSORPTION DEVICE, FILM FORMING DEVICE, ADSORPTION METHOD, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2021141312
Kind Code:
A
Abstract:
To adsorb an object to be adsorbed to an electrostatic chuck well.SOLUTION: An adsorption device according to the present invention includes a support unit that supports the peripheral edge of a first main surface of an object to be adsorbed having the first main surface and a second main surface opposite to the first main surface, adsorption means for adsorbing the object to be adsorbed from the second main surface side of the object to be adsorbed, and a plurality of pressing members for pressing the object to be adsorbed from the second main surface side of the object to be adsorbed, and the plurality of pressing members are respectively arranged at positions corresponding to at least two corners of the plurality of corners of the second main surface of the object to be adsorbed.SELECTED DRAWING: Figure 3

Inventors:
ISHII HIROSHI
MOROHASHI SATORU
KAWABATA TOMOYO
KASHIWAKURA KAZUFUMI
TOMII HIROKI
HOSOYA AKIYUKI
UEDA TOSHIYUKI
Application Number:
JP2021005285A
Publication Date:
September 16, 2021
Filing Date:
January 15, 2021
Export Citation:
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Assignee:
CANON TOKKI CORP
AOI KK
SODICK CO LTD
International Classes:
H01L21/683; C23C14/04; H01L51/50; H05B33/10
Domestic Patent References:
JP2017155338A2017-09-07
JP2006188313A2006-07-20
JP2012092395A2012-05-17
JP2014126762A2014-07-07
JP2003152059A2003-05-23
JP2013204097A2013-10-07
JP2014065959A2014-04-17
JP2008116354A2008-05-22
JP2004055585A2004-02-19
JP2000216144A2000-08-04
Attorney, Agent or Firm:
Patent Business Corporation Otsuka International Patent Office