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Title:
ELECTROSTATIC CHUCK INCLUDING COOLING GAS SECTION, CORRESPONDING GROOVE AND UNIPOLAR ELECTROSTATIC CLAMP ELECTRODE PATTERN
Document Type and Number:
Japanese Patent JP2021153202
Kind Code:
A
Abstract:
To provide an electrostatic chuck for a substrate processing system.SOLUTION: An electrostatic chuck 200 for a substrate processing system includes a bottom plate 204, an intermediate layer disposed on the bottom plate, and a top plate 202. The top plate is joined to the bottom plate via the intermediate layer and electrostatically clamps a substrate. The top plate includes a unipolar clamp electrode and seals. The unipolar clamp electrode includes a groove opening pattern having cooling gas groove (210A-210D) opening sets 230, 240. The seals 206A-206C separate a cooling gas section. The cooling gas section includes four or more cooling gas sections. Each cooling gas section includes separate cooling gas groove sets. The top plate includes the separate cooling gas groove sets. Each of the separate cooling gas groove sets includes one or more cooling gas supply holes and corresponds to each of the cooling gas groove opening sets.SELECTED DRAWING: Figure 2

Inventors:
ALEXANDER MATYUSHKIN
KEITH LAURENCE COMENDANT
JOHN PATRICK HOLLAND
Application Number:
JP2021102828A
Publication Date:
September 30, 2021
Filing Date:
June 22, 2021
Export Citation:
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Assignee:
LAM RES CORP
International Classes:
H01L21/683; H01L21/3065; H01L21/31
Domestic Patent References:
JP2005136104A2005-05-26
JP2011114178A2011-06-09
JP2015088743A2015-05-07
JP2010141081A2010-06-24
JP2014072355A2014-04-21
JP2005079415A2005-03-24
JP2006013256A2006-01-12
Attorney, Agent or Firm:
Meisei International Patent Office