Title:
ADHESIVE COMPOSITION AND STRUCTURE
Document Type and Number:
Japanese Patent JP2021165397
Kind Code:
A
Abstract:
To provide an adhesive composition having excellent storage stability.SOLUTION: This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (excluding compounds classified as the first silane compound); and a peroxide having a one-minute half-life temperature of 120°C or lower.SELECTED DRAWING: Figure 1
Inventors:
MORIJIRI TOMOKI
TAKETAZU JUN
TANAKA MASARU
TATEZAWA TAKASHI
KUDO SUNAO
TAKETAZU JUN
TANAKA MASARU
TATEZAWA TAKASHI
KUDO SUNAO
Application Number:
JP2021110078A
Publication Date:
October 14, 2021
Filing Date:
July 01, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C09J4/00; C09J7/35; C09J11/04; C09J11/06; H05K3/36
Domestic Patent References:
| JP2011199097A | 2011-10-06 | |||
| JP2003060107A | 2003-02-28 | |||
| JP2012072305A | 2012-04-12 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano