Title:
METHOD FOR MANUFACTURING COMPONENT BY ATOMIC DIFFUSION BONDING
Document Type and Number:
Japanese Patent JP2021168377
Kind Code:
A
Abstract:
To provide a method for manufacturing a component by joining two plates and constructing a metal layer embedded between the plates.SOLUTION: Two plates are electrically insulated. At least one of the plates is optically transparent and forms at least one flat conductor unit and at least one isolator unit between the plates. With a method, a metal layer is disposed between the plates. The metal layer is locally heated using laser irradiation to process the metal layer so that the metal layer is converted into at least one isolator unit in part of a region. A least one conductor unit is formed adjacent to at least one isolator unit to convert the metal layer into the isolator unit beyond a line or an area. The plate is ground on a bonding surface side. A bonding surface is formed by a metal bonding layer. Bonding of the plate includes an atomic diffusion bonding. The metal bonding layer forms the metal layer between the bonded plates.SELECTED DRAWING: Figure 1
Inventors:
JAN INGWERSEN
DAVID KIEVEN
DAVID KIEVEN
Application Number:
JP2021025838A
Publication Date:
October 21, 2021
Filing Date:
February 22, 2021
Export Citation:
Assignee:
BERLINER GLAS GMBH
International Classes:
H01L21/02; B23K20/00
Attorney, Agent or Firm:
Katsuhiro Imashita
Kenji Okada
Masaaki Hata
Mari Tanaka
Kenji Okada
Masaaki Hata
Mari Tanaka