Title:
ELECTROMAGNETIC WAVE ATTENUATING FILM
Document Type and Number:
Japanese Patent JP2022186726
Kind Code:
A
Abstract:
To provide an electromagnetic wave attenuating film that can attenuate a radio wave with a frequency in a millimeter wave band, the electromagnetic wave attenuating film being thin and excellent in environment resistance such as weatherability and heat resistance.SOLUTION: The present invention is an electromagnetic wave attenuating film comprising a dielectric substrate having a front face and a back face, a thin-film conductive layer arranged on the front face, and a flat-plate inductor or a laminated layer arranged on the back face. A top coat layer composed of resin material may be provided on the thin-film conductive layer. The thin-film conductive layer includes a plurality of metal plates. When the thickness and the skin depth of the metal plate are T and d, respectively, the following formula is satisfied in a frequency band of 35 GHz-50 GHz. -2.0≤ln(T/d)≤-0.5.SELECTED DRAWING: Figure 7
Inventors:
Atsuko Aoki
Shinpei Kondo
Shinpei Kondo
Application Number:
JP2022155642A
Publication Date:
December 15, 2022
Filing Date:
September 29, 2022
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H05K9/00; B32B7/025; C08J5/18; H01Q17/00
Attorney, Agent or Firm:
Patent Business Corporation Daiichi International Patent Office