Title:
ADHESIVE COMPOSITION, ADHESIVE LAYER, AND ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2023111870
Kind Code:
A
Abstract:
To provide an adhesive composition from which an adhesive layer having a low dielectric constant can be formed.SOLUTION: Provided is an adhesive composition which contains a polyester resin containing a structural unit derived from a compound having at least 20 carbon atoms and at least two functional groups capable of forming an ester bond. The dielectric constant of the adhesive composition is at most 4.0 at a frequency of 100 kHz when an adhesive layer is formed. Preferably, the dielectric loss of the adhesive composition is preferably 0.0001-0.15 at a frequency of 100 kHz when an adhesive layer is formed.SELECTED DRAWING: Figure 1
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Inventors:
SHIBANO MASAYA
HORIUCHI YOSHIYUKI
KATAMI FUSHI
HORIUCHI YOSHIYUKI
KATAMI FUSHI
Application Number:
JP2023006213A
Publication Date:
August 10, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J167/00; C09J7/38
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical