Title:
POLYAMIDE-IMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP2023114303
Kind Code:
A
Abstract:
To provide a polyamide-imide (PAI) composition which can give a polyamide-imide (PAI) film achieving both a high elastic modulus and high elongation when molded into a film shape.SOLUTION: The polyamide-imide (PAI) composition satisfies the following 1) and 2): 1) it comprises two or more kinds of polyamide-imides (PAI) each of which uses trimellitic anhydride (TMA) as an acid component and o-tolidine diisocyanate (TODI) as an isocyanate component and which are different in copolymerization amount of a dimer acid (DA) as an acid component; and 2) the ratio (DA×100/(TMA+DA)) of the number of moles of the DA to the total number of moles of the TMA and the DA in the PAI composition is less than 30 mol%.SELECTED DRAWING: None
Inventors:
YOSHINO FUMIKO
MORIKITA TATSUYA
SHIBATA KENTA
YAMADA MUNENORI
ECHIGO YOSHIAKI
MORIKITA TATSUYA
SHIBATA KENTA
YAMADA MUNENORI
ECHIGO YOSHIAKI
Application Number:
JP2022016596A
Publication Date:
August 17, 2023
Filing Date:
February 04, 2022
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08L79/08; C08G73/14; C08J5/18