Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2023114977
Kind Code:
A
Abstract:
To provide a substrate processing apparatus having high convenience concerning coating of coating liquid on a substrate.SOLUTION: A resist coating apparatus 1 comprises: a spin chuck 12a which holds and rotates a substrate W; a cup 21a arranged to surround the substrate W which is held on a spin chuck 12a; and a coating liquid nozzle 41 configured in such a manner that it can inject the coating liquid to the substrate W. The resist coating apparatus 1 further comprises: a liquid removal nozzle 50a; and a nozzle tracking camera 60 which tracks the coating liquid nozzle 41 to move by being attached to a nozzle arm 133 holding the coating liquid nozzle 41 and is configured to be able to image the coating liquid nozzle 41. Further, the resist coating apparatus 1 comprises a processing space camera which can image a processing space on the spin chuck 12a.SELECTED DRAWING: Figure 1
Inventors:
KUNUGIMOTO YUICHIRO
KAJIWARA HIDEKI
MATSUURA KAZUHIRO
MIZUSHINO SHINICHI
SHIGEMOTO HOKUTO
TOYOSAWA SODAI
SAKAI YUJI
KAJIWARA HIDEKI
MATSUURA KAZUHIRO
MIZUSHINO SHINICHI
SHIGEMOTO HOKUTO
TOYOSAWA SODAI
SAKAI YUJI
Application Number:
JP2022195694A
Publication Date:
August 18, 2023
Filing Date:
December 07, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; B05C5/00; B05C11/00; B05C11/08; B05C11/10; B05D1/40; B05D3/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Yasushi Naito
Yoshiki Kuroki
Junji Kashiwaoka
Shigeki Matsuo
Yasushi Naito