Title:
SEMICONDUCTOR DEVICE WITH DOLMEN STRUCTURE, MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF SUPPORT PIECE, AND MULTILAYER FILM FOR SUPPORT PIECE FORMATION
Document Type and Number:
Japanese Patent JP2023115060
Kind Code:
A
Abstract:
To provide a manufacturing method of a support piece for efficiently manufacturing the support piece improved in visibility using a camera.SOLUTION: The present invention relates to a manufacturing method of a support piece used in a manufacturing process of a semiconductor device with a dolmen structure including: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip supported by the plurality of support pieces and disposed so as to cover the first chip. The manufacturing method of the support piece includes the steps of: (A) preparing a multilayer film successively comprising a base material film, an adhesive layer and a film for support piece formation with a multilayer structure including at least a metal layer; (B) forming the plurality of support pieces on a surface of the adhesive layer by individualizing the film for support piece formation; and (C) picking up the support piece from the adhesive layer.SELECTED DRAWING: Figure 1
More Like This:
| JP2023531486 | Electrode output structure for xstacking architecture |
| WO/2020/085256 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| JP2008226945 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
Inventors:
HASHIMOTO SHINTARO
TANIGUCHI KOHEI
YAHATA TATSUYA
OZAKI YOSHINOBU
TANIGUCHI KOHEI
YAHATA TATSUYA
OZAKI YOSHINOBU
Application Number:
JP2023096869A
Publication Date:
August 18, 2023
Filing Date:
June 13, 2023
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
H01L25/07; C09J7/38
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano