Title:
METHOD AND DEVICE OF GRINDING SEMICONDUCTOR STRIP
Document Type and Number:
Japanese Patent JP2023160761
Kind Code:
A
Abstract:
To provide a method and device of grinding a semiconductor strip capable of shortening the time required for a grinding step.SOLUTION: Provided is a method and device of grinding a semiconductor strip. The method of grinding a semiconductor strip includes the steps of: vacuum-suctioning a semiconductor strip onto a chuck table; rotating a grinding wheel with a grinding stone attached to a lower surface; moving the chuck table in a horizontal direction so as to perform grinding from a peripheral edge part of the semiconductor strip toward a center part, moving the chuck table until a peripheral edge part of the grinding wheel is located above a center part of the chuck table to partially remove a surface part of the semiconductor strip by a preset rough cutting thickness; and rotating the chuck table to wholly remove the surface part of the semiconductor strip by the preset rough cutting thickness.SELECTED DRAWING: Figure 1
Inventors:
SONG JIN KYU
HWANG EUI DOO
CHUNG UN TAE
DO WOO JIN
KIM KI RAK
HWANG EUI DOO
CHUNG UN TAE
DO WOO JIN
KIM KI RAK
Application Number:
JP2023064948A
Publication Date:
November 02, 2023
Filing Date:
April 12, 2023
Export Citation:
Assignee:
SEO TECH CO LTD
International Classes:
H01L21/304; B24B1/00; B24B7/02; B24B7/04
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda
Hironobu Onda
Atsushi Honda