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Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2023160901
Kind Code:
A
Abstract:
To realize a suitable wiring pattern for electrically connecting multiple light-emitting elements, in a light-emitting device where the multiple light-emitting elements are arranged on one face.SOLUTION: A light-emitting device has multiple semiconductor laser elements placed on the bottom face, a frame part surrounding the multiple semiconductor laser elements placed on the bottom face, a light reflection member for reflecting laser light, progressing from the multiple semiconductor laser elements placed on the bottom face toward the first inside surface of the frame part, a step part formed along the second inside surface of the frame part on the inside of a frame formed by the top face of the frame part, multiple metal films provided on the top face of the step part, multiple wires for electrically connecting the multiple semiconductor laser elements, and a protection element placed on the top face of the step part on the farther light progressing side than a plane including the light emission end face of the semiconductor laser element.SELECTED DRAWING: Figure 4

Inventors:
MIURA SOICHIRO
OKUNO RYOTA
Application Number:
JP2023141906A
Publication Date:
November 02, 2023
Filing Date:
September 01, 2023
Export Citation:
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Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01S5/02345; H01S5/02208; H01S5/02255; H01S5/023; H01S5/40
Domestic Patent References:
JP2017085036A2017-05-18
JP2011254080A2011-12-15
JP2016518726A2016-06-23
JP2010278098A2010-12-09
JP2011204983A2011-10-13
JP2015228401A2015-12-17
JP2013218847A2013-10-24
JP2006269934A2006-10-05
JP2008072013A2008-03-27
Foreign References:
US20150255949A12015-09-10
US20130272329A12013-10-17
WO2016082919A12016-06-02
DE102015012816A12017-04-06