Title:
MANUFACTURING SYSTEM, PRODUCTION METHOD THEREOF, PRODUCTION DEVICE AND SYSTEM
Document Type and Number:
Japanese Patent JP2023160983
Kind Code:
A
Abstract:
To provide a semiconductor device capable of reducing stress on a circuit board side during a mounting process.SOLUTION: A semiconductor device includes multiple electrode pads 2, and a resist having an opening on the multiple electrode pads 2. The opening has, from the electrode pad side, a tapered opening 8a, a stress relief opening 8b, and a columnar opening 8c. The tapered opening 8a has a straight slope, and the stress relief opening 8b has a shape of a truncated cone having a slope curved inward with a bottom area larger than a top area. The stress relief opening 8b has a shape that a side surface of the stress relief opening 8b bulges out laterally from a bottom surface of the stress relief opening 8b. The opening has a constricted shape at a surface where tapered opening 8a and stress relief opening 8b meet.SELECTED DRAWING: Figure 2E
Inventors:
SAKURAI DAISUKE
ITOI SEIICHI
ITOI SEIICHI
Application Number:
JP2023148436A
Publication Date:
November 02, 2023
Filing Date:
September 13, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/60
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office