Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2504306
Kind Code:
B2
Inventors:
YOSHIMURA HIDEFUMI
Application Number:
JP18991690A
Publication Date:
June 05, 1996
Filing Date:
July 16, 1990
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/318; (IPC1-7): H01L21/318
Domestic Patent References:
| JP6468967A | ||||
| JP6447032A | ||||
| JP63155626A |
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)