【発明の名称】半導体装置

Title:

【発明の名称】半導体装置

Document Type and Number:

Japanese Patent JP2519259

Kind Code:

B2

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Inventors:

SATO HAJIME
SUZUKI HIROMICHI

Application Number:

JP23465587A

Publication Date:

July 31, 1996

Filing Date:

September 17, 1987

Export Citation:

Assignee:

HITACHI LTD

International Classes:

H01L23/50; H01L23/28; (IPC1-7): H01L23/28

Domestic Patent References:

JP61258458A

Attorney, Agent or Firm:

Akita Aki

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