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Title:
【発明の名称】半導体製造設備
Document Type and Number:
Japanese Patent JP2520410
Kind Code:
B2
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Inventors:
IWASAKI TAKEMASA
SHIMOSHA SADAO
Application Number:
JP3462287A
Publication Date:
July 31, 1996
Filing Date:
February 19, 1987
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23Q41/00; H01L21/677; H01L21/68; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Masami Akimoto



 
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