Title:
【考案の名称】電子回路組立体
Document Type and Number:
Japanese Patent JP2523657
Kind Code:
Y2
Inventors:
Shoji Oiwa
Uchiyama Makoto
Uchiyama Makoto
Application Number:
JP3162191U
Publication Date:
January 29, 1997
Filing Date:
April 09, 1991
Export Citation:
Assignee:
Nippon Servo Co., Ltd.
International Classes:
H01L23/34; H05K1/14; H05K7/20; (IPC1-7): H05K1/14; H01L23/34; H05K7/20