Title:
【発明の名称】半導体集積回路モジュ―ル
Document Type and Number:
Japanese Patent JP2536886
Kind Code:
B2
Abstract:
PURPOSE:To reduce the deformation of a substrate and to contrive the improvement of the reliability of the title module by a method wherein heating mediums are provided in the interior or the surface in the vicinities of the side surfaces of the substrate or in the vicinities of input/output pins to control the movement of heat in the substrate and the temperature distribution in the substrate is uniformized. CONSTITUTION:Heat generated in semiconductor elements 1 is transmitted to a substrate 5A through solder bumps 4 or sealing gases 6 and is further moved to IO pins 7 of a low temperature part, substrate side surfaces 9 or a sealing solder 8. Here, heating mediums 21A are provided in the interior or the surface in the vicinities of the substrate side surfaces 9, which are the peripheries of the substrate 5A, to heat the low temperature part, whereby the movement of the above heat is limited and the temperature in the substrate is uniformized. Thereby, as a stress, which is generated in the module sealing solder, the solder bumps or the substrate interior, can be reduced, the reliability of a semiconductor integrated circuit module can be improved.
Inventors:
KIEDA SHIGEKAZU
OOGURO TAKAHIRO
OOGURO TAKAHIRO
Application Number:
JP29601887A
Publication Date:
September 25, 1996
Filing Date:
November 26, 1987
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/34; (IPC1-7): H01L23/34
Domestic Patent References:
| JP61264744A | ||||
| JP62174345U |
Attorney, Agent or Firm:
Akio Takahashi (1 person outside)