Title:
【発明の名称】半導体素子研磨装置
Document Type and Number:
Japanese Patent JP2544987
Kind Code:
B2
Inventors:
TSURUHARA KENJI
Application Number:
JP7996890A
Publication Date:
October 16, 1996
Filing Date:
March 28, 1990
Export Citation:
Assignee:
SHARP KK
International Classes:
B23K15/00; H01L21/027; H01L21/30; H01L21/304; (IPC1-7): H01L21/304; B23K15/00
Attorney, Agent or Firm:
Koji Onishi