Title:
【発明の名称】半導体装置のパッド構造
Document Type and Number:
Japanese Patent JP2549679
Kind Code:
B2
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Inventors:
MIHARA TERUYOSHI
Application Number:
JP30874587A
Publication Date:
October 30, 1996
Filing Date:
December 08, 1987
Export Citation:
Assignee:
NISSAN MOTOR
International Classes:
H01L23/60; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; H01L23/60
Attorney, Agent or Firm:
Yasuo Miyoshi (1 outside)