【考案の名称】半導体装置の実装構造

Title:

【考案の名称】半導体装置の実装構造

Document Type and Number:

Japanese Patent JP2554059

Kind Code:

Y2

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Inventors:

Onishi Tetsuya
Kiyota
Kazuhiko Hashimoto
Wakamoto Setsunobu

Application Number:

JP2047088U

Publication Date:

November 12, 1997

Filing Date:

February 18, 1988

Export Citation:

Assignee:

Sharp Corporation

International Classes:

H01L21/60; H01L23/28; (IPC1-7): H01L23/28; H01L21/60

Domestic Patent References:

Attorney, Agent or Firm:

Takeshi Sugiyama (1 outside)

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