Title:
【考案の名称】半導体装置の接続構造
Document Type and Number:
Japanese Patent JP2556672
Kind Code:
Y2
Inventors:
Kenji Imai
Application Number:
JP12274889U
Publication Date:
December 08, 1997
Filing Date:
October 19, 1989
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L21/768; H01L21/28; H01L23/522; H01L29/43; (IPC1-7): H01L21/768
Domestic Patent References:
| JP6047445A |
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)