Title:
【考案の名称】混成集積回路基板
Document Type and Number:
Japanese Patent JP2563336
Kind Code:
Y2
Inventors:
English by Hatanaka
Yokote
Yokote
Application Number:
JP7904992U
Publication Date:
February 18, 1998
Filing Date:
October 20, 1992
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L23/12; H05K1/16; H05K3/28; (IPC1-7): H05K3/28; H01L23/12; H05K1/16
Domestic Patent References:
| JP357290A | ||||
| JP56146295A |