Title:
【発明の名称】パターン形成材料及びそれを用いた多層配線板
Document Type and Number:
Japanese Patent JP2571072
Kind Code:
B2
Abstract:
PURPOSE:To obtain a pattern forming material which is highly resistant to heat and is capable of forming fine patterns even with thick films by incorporating an org. silicon compd. further into a photosensitive resin compsn. contg. a specific alkali soluble silicone polymer and orthonaphthoquinone sensitizing agent. CONSTITUTION:The org. silicon compd. is further incorporated into the photosensitive resin compsn. contg. the alkali soluble silicone polymer expressed by the formula I or II and the orthonaphthoquinone sensitizing agent. In the formulas I, II, X denotes the group consisting of R-C(=O)-, R-CH(OH)- and carboxyl group; R denotes a hydrocarbon group; R'-R'<4> denote the group consisting of a hydroxyl group, alkyl group and phenyl group; l, m, n denote 0 or positive integer. The formation of the heat resistant and fine patterns and the formation of the thick films are thereby enabled.
Inventors:
BAN KOJI
TANAKA HARUYORI
TANAKA HARUYORI
Application Number:
JP25952187A
Publication Date:
January 16, 1997
Filing Date:
October 16, 1987
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
G03C1/00; G03C1/72; G03F7/004; G03F7/075; H01L21/312; H01L21/768; H01L23/522; H05K3/46; (IPC1-7): G03F7/075; G03F7/004; H01L21/312; H01L21/768; H05K3/46
Domestic Patent References:
| JP6236662A | ||||
| JP59125730A | ||||
| JP63285538A | ||||
| JP63241542A |
Attorney, Agent or Firm:
Hiroshi Nakamoto (2 outside)