Title:
【発明の名称】銅へのガラスセラミックス接着の改良
Document Type and Number:
Japanese Patent JP2571323
Kind Code:
B2
Abstract:
Disclosed is a method for promoting adhesion of cofired copper-based metallurgy and glass-ceramic dielectric including the step of adding powders of an alloying metal to the copper-based metallurgy prior to firing. Also disclosed is a metallizing paste exhibiting superior adhesion to glass-ceramics. The paste includes an organic carrier, copper powder and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.
Inventors:
NUNJIO DEIPAORO
ANANDA HOSAKERE KUMARU
RABERU BERII UIGINZU
ANANDA HOSAKERE KUMARU
RABERU BERII UIGINZU
Application Number:
JP1989192A
Publication Date:
January 16, 1997
Filing Date:
February 05, 1992
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
C03C17/06; C03C27/04; C04B37/02; H01B1/02; H01L21/48; H01L23/498; H05K1/09; H05K3/46; (IPC1-7): C04B37/02; C03C17/06; H05K3/46
Domestic Patent References:
| JP2126700A | ||||
| JP63168904A |
Attorney, Agent or Firm:
Koichi Tonmiya (1 person outside)
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