Title:
【発明の名称】改善された組合せの極限引張強さ、電気伝導性および耐応力緩和性を有する電気コネクタ用銅基合金
Document Type and Number:
Japanese Patent JP2572042
Kind Code:
B2
Abstract:
A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.
Inventors:
RONARUDO ENU KYARON
JON EFU BURIIDEISU
JON EFU BURIIDEISU
Application Number:
JP9662286A
Publication Date:
January 16, 1997
Filing Date:
April 25, 1986
Export Citation:
Assignee:
OLIN CORP
International Classes:
C22F1/08; C22C9/06; C22F1/00; H01B1/02; H01L23/495; (IPC1-7): C22C9/06; C22F1/08
Domestic Patent References:
| JP58123862A | ||||
| JP59145746A |
Attorney, Agent or Firm:
Akira Asamura (2 outside)