Title:
【考案の名称】回路基板を有する半導体装置
Document Type and Number:
Japanese Patent JP2577639
Kind Code:
Y2
Inventors:
Kazumi Takahata
Tomoyuki Ihara
Tomoyuki Ihara
Application Number:
JP4098493U
Publication Date:
July 30, 1998
Filing Date:
July 28, 1993
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L21/52; H05K7/14; (IPC1-7): H01L21/52
Domestic Patent References:
| JP2246359A | ||||
| JP4312932A | ||||
| JP63178342U |
Attorney, Agent or Firm:
Keiichi Shimizu (1 person outside)