Title:
【発明の名称】放熱性のすぐれた半導体装置用基板
Document Type and Number:
Japanese Patent JP2590558
Kind Code:
B2
Inventors:
KUROMITSU YOSHIO
YOSHIDA HIDEAKI
TANAKA TADAHARU
UCHIDA HIROTO
NAGASE TOSHUKI
YOSHIDA HIDEAKI
TANAKA TADAHARU
UCHIDA HIROTO
NAGASE TOSHUKI
Application Number:
JP2801689A
Publication Date:
March 12, 1997
Filing Date:
February 07, 1989
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
H01L23/15; H05K1/03; (IPC1-7): H01L23/15; H05K1/03
Domestic Patent References:
| JP6484648A | ||||
| JP1301575A | ||||
| JP61119094A | ||||
| JP62216979A | ||||
| JP2205345A | ||||
| JP2207554A |
Attorney, Agent or Firm:
Kazuo Tomita (1 person outside)