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Patent Searching and Data


Title:
【発明の名称】粗位置決め装置
Document Type and Number:
Japanese Patent JP2591844
Kind Code:
B2
Abstract:
An improved mechanism for the coarse adjustment of a stage especially for a scanning tunneling microscope stage is described. The stage (13) is moved by forces transmitted through rigid wire springs (10, 64, 88) mounted on leaf spring (40, 60, 84) assemblies which transmit the motion from rigidly mounted micrometer adjusting devices (44, 52, 80). The coarse adjustment mechanism of the present invention provides improved performance over coarse adjustment mechanisms presently available for STM applications. The present invention replaces separate sets of leaf springs for X and Y motion with a single set of four wire springs. This simplifies the design and increases the rigidity and stability by reducing the mechanical path length from the solid base to the X-Y-Z stage (13). The screw mechanisms (44, 52, 80) are all directly connected to the rigid base. This is made possible by the additional pairs of wire springs connected from the X and Y screws to the stage. The following advantages are achieved first, since the screw mechanisms do not move with the stage (13), driving mechanisms such as motors and gears can be simply connected; and, second, the rigidity and stability are increased since the stage (13) position is referenced directly to the base through all three screws rather than through intermediate support structures.

Inventors:
MAAKU AAMUSUTORONGU MATSUKUKOODO
Application Number:
JP11065690A
Publication Date:
March 19, 1997
Filing Date:
April 27, 1990
Export Citation:
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Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
G01B7/34; F16M11/12; G01B21/00; G01N27/00; G01Q10/02; G01Q60/16; G12B5/00; (IPC1-7): G12B5/00; G01B7/34; G01N37/00
Domestic Patent References:
JP63236991A
Attorney, Agent or Firm:
Koichi Tonmiya (1 person outside)