Title:
【考案の名称】基板のディップ処理装置
Document Type and Number:
Japanese Patent JP2594577
Kind Code:
Y2
Inventors:
Hirose road
Application Number:
JP7323991U
Publication Date:
April 26, 1999
Filing Date:
September 11, 1991
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
B05C3/12; B05C9/10; H01L21/304; (IPC1-7): H01L21/304
Domestic Patent References:
| JP587830A | ||||
| JP63157928U | ||||
| JP252436U |
Attorney, Agent or Firm:
Mitsuharu Kiuchi