Title:
【発明の名称】圧電部品
Document Type and Number:
Japanese Patent JP2596234
Kind Code:
B2
Abstract:
PURPOSE:To effectively disperse the force applied from above when a piezoelectric substrate is imposed on a plane and an adhesive tape is stuck thereto from above by imparting level difference eliminating materials so as to have a height approximately equal to the height of solder resist materials, on at least one main surface of the piezoelectric substrate provided with the solder resist materials. CONSTITUTION:Electrodes 13a, 14a are formed on both main surfaces of the piezoelectric substrate 12a and the solder resist materials 15a, 16a are imparted to these electrodes 13a, 14a. The level difference eliminating materials 17a, 18a are imparted to the main surfaces of the piezoelectric substrate 12a so as to have the height approximately equal to the height of the resist materials 15a, 16a. Consequently, the force arising from the sticking of the adhesive tape is dispersed to the solder resist material 15a or 16a and the level difference eliminating material 17a or 18a even if this tape is stuck from above while the piezoelectric substrate 12a is held imposed on the plane and, therefore, the generation of cracks and the cracking of the element are prevented.
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Inventors:
Mitsuru Tanaka
Application Number:
JP3299491A
Publication Date:
April 02, 1997
Filing Date:
February 27, 1991
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B06B1/06; H01L41/08; (IPC1-7): B06B1/06; H01L41/08
Domestic Patent References:
| JP58191600A |
Attorney, Agent or Firm:
Miyazaki Main Tax