Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP2599037
Kind Code:
B2
Inventors:
Kazuo Agata
Masakazu Furuta
Masakazu Furuta
Application Number:
JP9428191A
Publication Date:
April 09, 1997
Filing Date:
April 24, 1991
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L29/73; H01L21/331; H01L29/732; H01L29/74; (IPC1-7): H01L21/331; H01L29/73; H01L29/74
Domestic Patent References:
| JP5823472A |
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)