Title:
【発明の名称】三次元半導体集積回路の製造方法
Document Type and Number:
Japanese Patent JP2603623
Kind Code:
B2
Inventors:
Mitsuo Matsunami
Kiba Masayoshi
Kiba Masayoshi
Application Number:
JP27224986A
Publication Date:
April 23, 1997
Filing Date:
November 14, 1986
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L27/00; H01L21/02; H01L21/31; H01L21/8222; H01L21/8234; H01L27/06; H01L27/082; H01L27/088; (IPC1-7): H01L27/00; H01L21/02
Domestic Patent References:
| JP61127157A | ||||
| JP61174661A |
Attorney, Agent or Firm:
Umeda Masaru (2 outside)