Title:
【発明の名称】無溶媒の硬化性料組成物
Document Type and Number:
Japanese Patent JP2605078
Kind Code:
B2
Abstract:
Curable organosilicon compounds which contain (meth)acrylamido-substituted hydrocarbon radicals have their viscosities greatly reduced by the addition of a small amount of a vinyl monomer compound. Advantageously, the resulting compositions are more easily applied to a substrate, such as paper, in fast-paced coating operations without the significant loss of useful properties, such as the cure rate of the curable composition and the adhesive release behavior of the cured composition.
Inventors:
John Robert Kerrick
Padmakumary Jay Baraplus
Anthony P. Wright
Padmakumary Jay Baraplus
Anthony P. Wright
Application Number:
JP2586688A
Publication Date:
April 30, 1997
Filing Date:
February 08, 1988
Export Citation:
Assignee:
Dow Corning Corporation
International Classes:
C08F299/08; C08F230/08; C08F283/12; C08F290/00; C08F290/06; C08F290/14; C09D183/04; C09D183/07; C09D183/10; (IPC1-7): C09D183/07; C08F283/12; C08F290/06; C09D183/10
Attorney, Agent or Firm:
Warren G. Simor