【考案の名称】半導体装置用軽量基板 - Mitsubishi Materials Corporation

Title:

【考案の名称】半導体装置用軽量基板

Document Type and Number:

Japanese Patent JP2607699

Kind Code:

Y2

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Inventors:

Hideaki Yoshida
Akira Mori
Shiro Kuromitsu
Yoshio Kanda

Application Number:

JP292896U

Publication Date:

March 04, 2002

Filing Date:

April 12, 1996

Export Citation:

Assignee:

Mitsubishi Materials Corporation

International Classes:

C04B37/02; H01L23/14; H01L23/36; (IPC1-7): H01L23/14; C04B37/02; H01L23/36

Domestic Patent References:

JP59121890A
JP6071579A

Attorney, Agent or Firm:

Kazuo Tomita (1 person outside)

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