Title:
【発明の名称】バイポーラ型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2615958
Kind Code:
B2
Inventors:
Kazuyuki Kurita
Application Number:
JP157789A
Publication Date:
June 04, 1997
Filing Date:
January 06, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L29/73; H01L21/331; H01L29/732; (IPC1-7): H01L21/331; H01L29/73
Attorney, Agent or Firm:
Teiichi