Title:
【発明の名称】半導体製造装置
Document Type and Number:
Japanese Patent JP2618277
Kind Code:
B2
Inventors:
Uramoto Iwami
Application Number:
JP29400189A
Publication Date:
June 11, 1997
Filing Date:
November 14, 1989
Export Citation:
Assignee:
Kaijo Co., Ltd.
International Classes:
H01L23/50; H01L21/50; (IPC1-7): H01L23/50; H01L21/50
Domestic Patent References:
| JP61101034A | ||||
| JP62249427A | ||||
| JP6037737A |
Attorney, Agent or Firm:
Shoji Hagiri