Title:
【発明の名称】樹脂封止半導体装置
Document Type and Number:
Japanese Patent JP2620243
Kind Code:
B2
Inventors:
Akihiro Kubota
Application Number:
JP16025787A
Publication Date:
June 11, 1997
Filing Date:
June 26, 1987
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP59161851A | ||||
| JP60201696A | ||||
| JP6151952A | ||||
| JP6173354A | ||||
| JP58140645U |
Attorney, Agent or Firm:
Teiichi