Title:
【発明の名称】半導体装置の樹脂封止装置の位置決め方法およびそれを実施する樹脂封止装置
Document Type and Number:
Japanese Patent JP2626306
Kind Code:
B2
Inventors:
Sueyoshi Tanaka
Koji Tsutsumi
Koji Tsutsumi
Application Number:
JP11976491A
Publication Date:
July 02, 1997
Filing Date:
May 24, 1991
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B29C45/02; B29C45/26; B29C45/36; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/26; H01L21/56
Domestic Patent References:
| JP249446A | ||||
| JP1161723A | ||||
| JP63181438A | ||||
| JP62269330A | ||||
| JP1117038A |
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)