Title:
【発明の名称】バンプ構造を有する半導体装置
Document Type and Number:
Japanese Patent JP2633586
Kind Code:
B2
Abstract:
A semiconductor device having a bump electrode (16) on a semiconductor substrate (11) above an electrode pad (12) and metal film (14a). The shape of the bump electrode (16) is composed of a cubical portion and a skirt (16a) extending outward from the bottom of the cubical portion. In manufacturing such a semiconductor device, a dry film is used which is laminated on the metal film (14a) under a certain laminating condition and formed with an opening. A bump material is formed as a deposit on the metal film (14a) within the opening, through electrolytic plating. The deposit has the cubical portion corresponding in shape to the opening, and the skirt (16a) extending outward into a space between the dry film and the metal film (14a), from the bottom of the cubical portion. The metal film (14a) is etched out using the deposit as a mask to thereby make the deposit as a bump electrode (16) of the semiconductor device.
Inventors:
ENDO TAKAYUKI
EZAWA HIROKAZU
EZAWA HIROKAZU
Application Number:
JP26596187A
Publication Date:
July 23, 1997
Filing Date:
October 21, 1987
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/60; H01L23/485; H01L23/532; (IPC1-7): H01L21/321
Domestic Patent References:
| JP5683952A | ||||
| JP59143343A | ||||
| JP51147253A | ||||
| JP60113446A | ||||
| JP5656656U |
Attorney, Agent or Firm:
Eiji Morota