Title:
【発明の名称】銅板とセラミックス基板との接合体の製造方法
Document Type and Number:
Japanese Patent JP2652074
Kind Code:
B2
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Inventors:
KANEHARA NAOYUKI
Application Number:
JP9333990A
Publication Date:
September 10, 1997
Filing Date:
April 09, 1990
Export Citation:
Assignee:
DOWA KOGYO KK
International Classes:
B23K20/00; B23K1/19; C04B37/02; (IPC1-7): C04B37/02; B23K1/19; B23K20/00
Attorney, Agent or Firm:
Maruoka Masahiko