Title:
半導体装置の外部導出端子
Document Type and Number:
Japanese Patent JP2658528
Kind Code:
B2
Inventors:
ARAI ETSUO
Application Number:
JP21130990A
Publication Date:
September 30, 1997
Filing Date:
August 09, 1990
Export Citation:
Assignee:
FUJI DENKI KK
International Classes:
H01L23/48; H01L23/50; (IPC1-7): H01L23/48
Domestic Patent References:
| JPS5344174A |
Attorney, Agent or Firm:
山口 巖