Title:
【発明の名称】電子デバイスの冷却装置
Document Type and Number:
Japanese Patent JP2675173
Kind Code:
B2
Abstract:
A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.
Inventors:
Takahiro Oguro
Ashibu
Nobuo Kawasaki
Chief officer
Ashibu
Nobuo Kawasaki
Chief officer
Application Number:
JP4926990A
Publication Date:
November 12, 1997
Filing Date:
March 02, 1990
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/36; H01L23/433; (IPC1-7): H01L23/36
Domestic Patent References:
| JP6424447A | ||||
| JP1187840A |
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)